Chipset maker Qualcomm is again proving to be an innovator in mobile broadband and is using a dual-modem solution for its upcoming Snapdragon 855 platform. The SoC will come up with an LTE modem (Snapdragon X24) and a 5G counterpart (Snapdragon X50) at the same time. There is a further tempo boost in terms of 4G connectivity up to 2 Gbit / s.
What is Snapdragon 855
The Snapdragon 845 SoC is the successor to 2017’s Snapdragon 835. It is made on Samsung’s second-generation 10LPP process, a refined version of 10LPE used for the 835, but according to a recent report, TSMC will be making the 7nm (FinFET) chips for the Snapdragon 855 SoC. Samsung recently announced that is working on 7LPP (Low Power Plus) with EUV (extreme ultra violet) lithography technology for smart phones that is targeted for initial production in the second half of 2018.
The same report said that Qualcomm is going with TSMC since it uses normal steppers while Samsung is going with 7nm EUV lithography tech which is riskier, and might not be ready on time.